IBM: Wii U’s processor is “some of our most advanced technology”
Following Nintendo’s reveal of the Wii U, IBM have today confirmed that they are to continue their relationship with the company in providing millions of processors for the console.
IBM stated that the processor set to be implemented within the Wii U is “some of our most advanced technology packed into an energy-saving silicon package,” and that the unique embedded DRAM “is capable of feeding the Wii U’s multi-core processor large chunks of data to make for a smooth entertainment experience.”
Their arrangement with Nintendo will see them produce millions of chips featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter), IBM further clarified. Such a chip is ideal for “performance-driven applications that demand exceptional, power-efficient processing capability.”
IBM were previously selected to manufacture the GameCube microprocessor, and have then been responsible for shipping over 90 million Wii chips.
“IBM has been a terrific partner for many years,” Nintendo R&D boss Genyo Takeda added. “We truly value IBM’s commitment to support Nintendo in delivering an entirely new kind of gaming and entertainment experience for consumers around the world.”